GENEVA, Sept. 18 -- LAM RESEARCH CORPORATION filed a patent application (US2026/017257) for “LOW-STRESS FILM FOR HIGH-ASPECT-RATIO METAL CONTACT FILL”. With publication no. WO/2026/187645, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C23C 16/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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