International Patent: LOW DENSITY AND THERMAL CONDUCTIVE 2K POLYURETHANE ADHESIVE

GENEVA, Oct. 22 -- DOW GLOBAL TECHNOLOGIES LLC filed a patent application (CN2025/089802) for “LOW DENSITY AND THERMAL CONDUCTIVE 2K POLYURETHANE ADHESIVE”. With publication no. WO/2026/218300, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08G 18/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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