INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "EASILY DISMANTLABLE ADHESIVE SHEET, LAMINATED STRUCTURE AND DISMANTLING METHOD"

GENEVA, March 3 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2025/028858) for "EASILY DISMANTLABLE ADHESIVE SHEET, LAMINATED STRUCTURE, AND DISMANTLING METHOD" on Aug 18, 2025. With publication no. WO/2026/042736, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MURAKAMI, Kamomi (c/o ...