GENEVA, April 28 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2025/035107) for "BONDING SHEET, METHOD FOR USING BONDING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Oct 02, 2025. With publication no. WO/2026/083829, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAMA...