INTERNATIONAL PATENT: LENOVO ENTERPRISE SO LUTIONS (SINGAPORE) PTE. LTD. FILES APPLICATION FOR "AIR DUCT CONTAINING HYBRID COOLED SIGNAL CONNECTORS IN A SERVER CHASSIS"

GENEVA, Feb. 20 -- LENOVO ENTERPRISE SO LUTIONS (SINGAPORE) PTE. LTD. (151, Lorong Chuan #02-01, New Tech Park, Singapore 556741) filed a patent application (PCT/CN2024/112222) for "AIR DUCT CONTAINING HYBRID COOLED SIGNAL CONNECTORS IN A SERVER CHASSIS" on Aug 15, 2024. With publication no. WO/2026/036308, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GAO, Tianyi (8F., No.66, Sanchong Rd., Nangang Dist., Taipei CityTaiwan 115), JIANG, Guodong (8F., No.66, Sanchong Rd., Nangang Dist., Taipei CityTaiwan 115), HUANG, Yong...