INTERNATIONAL PATENT: LE PAIN CO., LTD., 주식회사 르빵 FILES APPLICATION FOR "METHOD FOR PRODUCING FLOUR FOR SUGAR-FREE BAKING OR CONFECTIONERY"

GENEVA, March 3 -- LE PAIN CO., LTD. (B3, 307 Jahamun-ro,Jongno-gu,Seoul 03021), 주식회사 르빵 (서울특별시종로구자하문로 307, 지하3층) filed a patent application (PCT/KR2025/012651) for "METHOD FOR PRODUCING FLOUR FOR SUGAR-FREE BAKING OR CONFECTIONERY" on Aug 20, 2025. With publication no. WO/2026/043285, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIM, Tae Eon (102-701, 100 Nangye-roSeongdong...