GENEVA, Sept. 24 -- SIKA TECHNOLOGY AG filed a patent application (EP2026/052004) for “LAYERED PRODUCT INCLUDING ADHEREND, PRIMER AND SEALANT; METHOD FOR PRODUCING SAME; PRIMER COMPOSITION; AND USE OF DICARBONYL COMPOUND”. With publication no. WO/2026/195207, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 18/10
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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