GENEVA, Oct. 9 -- TOYOBO CO., LTD. filed a patent application (JP2026/012372) for “LAYERED FILM, PACKAGING MATERIAL, PACKAGING BAG, AND PACKAGING BODY”. With publication no. WO/2026/211563, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 27/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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