International Patent: LASER MACHINING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND LASER MACHINING METHOD

GENEVA, July 1 -- TOKYO ELECTRON LIMITED filed a patent application (JP2025/041367) for “LASER MACHINING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND LASER MACHINING METHOD”. With publication no. WO/2026/126805, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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