International Patent: LASER MACHINING APPARATUS, LASER MACHINING CONTROL DEVICE, AND LASER MACHINING METHOD

GENEVA, Oct. 1 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2025/041088) for “LASER MACHINING APPARATUS, LASER MACHINING CONTROL DEVICE, AND LASER MACHINING METHOD”. With publication no. WO/2026/191236, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B23K 26/382

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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