GENEVA, July 27 -- BYLD IPCO LLC filed a patent application (US2026/010379) for “LASER ETCHING METHOD AND APPARATUS”. With publication no. WO/2026/155915, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B23K 26/362
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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