GENEVA, July 2 -- BYSTRONIC LASER AG filed a patent application (EP2025/087664) for “LASER BEAM CUTTING DEVICE AND METHOD FOR LASER BEAM CUTTING”. With publication no. WO/2026/132010, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B23K 26/142
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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