GENEVA, Oct. 1 -- AGC INC. filed a patent application (JP2026/007908) for “LAMINATED SUBSTRATE, WIRING BOARD, METHOD FOR MANUFACTURING LAMINATED SUBSTRATE, METHOD FOR MANUFACTURING WIRING BOARD, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/191673, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 70/685
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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