INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "HIGH ASPECT RATIO FEATURE ETCHING BY MULTI-STATE PULSING"

GENEVA, Feb. 18 -- LAM RESEARCH CORPORATION (4650 Cushing Pkwy.Fremont, California 94538) filed a patent application (PCT/US2025/040274) for "HIGH ASPECT RATIO FEATURE ETCHING BY MULTI-STATE PULSING" on Aug 01, 2025. With publication no. WO/2026/035547, the details related to the patent application was published on Feb 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AGARWAL, Daksh (c/o Lam Research Corporation4650 Cushing Pkwy.Fremont, California 94538), HUANG, Min (c/o Lam Research Corporation4650 Cushing Pkwy.Fremont, California 94538), ESWARA SARMA, Sankar (c/o Lam Research Corporatio...