INTERNATIONAL PATENT: LAM, WAI KIN RAYMOND, 林伟健 FILES APPLICATION FOR "POWER CHIP EMBEDDED PACKAGE MODULE"

GENEVA, Feb. 23 -- LAM, Wai Kin Raymond (Room B12 10/F., No.52 Hung To Road, Kwun TongHong Kong 999077), 林伟健 (中国香港特别行政区观塘鸿图道52号10楼B12室) filed a patent application (PCT/CN2025/113527) for "POWER CHIP EMBEDDED PACKAGE MODULE" on Aug 08, 2025. With publication no. WO/2026/037201, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAM, Wai Kin Raymond (Room B12 10/F., No.52 Hung To Road, Kwu...