INTERNATIONAL PATENT: KYOCERA INTERNATIONAL, INC. FILES APPLICATION FOR "ELECTRONICS PACKAGE WITH HETEROGENOUS HEATSINK"

GENEVA, March 3 -- KYOCERA INTERNATIONAL, INC. (8611 Balboa AvenueSan Diego, California 92123) filed a patent application (PCT/US2025/041751) for "ELECTRONICS PACKAGE WITH HETEROGENOUS HEATSINK" on Aug 13, 2025. With publication no. WO/2026/043692, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MAKINO, Hiroshi (c/o Kyocera International, Inc. IP Dept.8611 Balboa AvenueSan Diego, California 92123), HIRA, Shinichi (c/o Kyocera International, Inc. IP Dept.8611 Balboa AvenueSan Diego, California 92123)

Abstract: An electron...