GENEVA, Feb. 17 -- KUREHA CORPORATION (3-3-2, Nihonbashi-Hamacho, Chuo-ku, Tokyo1038552), 株式会社クレハ (東京都中央区日本橋浜町三丁目3番2号) filed a patent application (PCT/JP2025/026990) for "MICROSPHERES, RESIN COMPOSITION FOR MOLDING, AND FOAM MOLDED BODY" on Jul 30, 2025. With publication no. WO/2026/034309, the details related to the patent application was published on Feb 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOBAYASHI Hi...