GENEVA, April 6 -- KRUTRIM SI DESIGNS PRIVATE LIMITED (8th Floor, Wing C, Prestige RMZ StartechBlock C, Industrial Layout, Hosur Road,Koramangala, Bengaluru Urban, KarnatakaBengaluru 560095) filed a patent application (PCT/IN2025/051534) for "HEAT DISSIPATION IN INTEGRATED CIRCUIT PACKAGES" on Sep 22, 2025. With publication no. WO/2026/069356, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MAHALINGAM, Saravanakumar (K, 504 Arvind Skylands, JakkurBangalore 560064), PATRA, Biswajit (Flat No F01, Pearl Regal Apartment. 39/1...