GENEVA, Feb. 24 -- KLA CORPORATION (One Technology DriveMilpitas, California 95035) filed a patent application (PCT/US2025/041002) for "FILM FRAME CARRIER WITH WHOLE WAFER HYBRID CHUCK" on Aug 07, 2025. With publication no. WO/2026/039265, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIM, Chow Tian (BLK 306, Bukit Batok St. 31, 03-121Singapore 650306), PATIL, Rajeev (4619 Rousillon AvenueFremont, California 94555)

Abstract: The system includes a chuck defining a planar surface and peripheral surface surrounding the pl...