GENEVA, April 19 -- KIMURA FOUNDRY CO.,LTD. (1157 Nagasawa, Shimizu-cho, Sunto-gun, Shizuoka4110905), 株式会社木村鋳造所 (静岡県駿東郡清水町長沢１１５７番地) filed a patent application (PCT/JP2025/030409) for "MOLD-FORMING BINDING AGENT COMPOSITION AND METHOD FOR MANUFACTURING MOLD USING SAME" on Aug 28, 2025. With publication no. WO/2026/079018, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizat...