GENEVA, April 28 -- JSW AFTY CORPORATION (2-1, Fukuura 2-chome, Kanazawa-ku, Yokohama-shi, Kanagawa2360004), JSWアフティ株式会社 (神奈川県横浜市金沢区福浦二丁目2番地1号) filed a patent application (PCT/JP2025/036486) for "FILM FORMING APPARATUS AND FILM FORMING METHOD" on Oct 16, 2025. With publication no. WO/2026/084022, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...