INTERNATIONAL PATENT: JSP CORPORATION, 株式会社ジェイエスピー FILES APPLICATION FOR "POLYPROPYLENE RESIN FOAM PARTICLES AND POLYPROPYLENE RESIN FOAM PARTICLE MOLDED BODY"

GENEVA, Jan. 6 -- JSP CORPORATION (4-2, Marunouchi 3-chome, Chiyoda-ku, Tokyo1000005), 株式会社ジェイエスピー (東京都千代田区丸の内三丁目４番２号) filed a patent application (PCT/JP2025/022116) for "POLYPROPYLENE RESIN FOAM PARTICLES AND POLYPROPYLENE RESIN FOAM PARTICLE MOLDED BODY" on Jun 19, 2025. With publication no. WO/2026/004743, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiz...