INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM (CHINA) COMPANY LIMITED, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "HOLLOW FILL ADDITIVE MANUFACTURING"

GENEVA, March 23 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM (CHINA) COMPANY LIMITED (1F, Building A1,No.55 Lane,Chuan He Road,Pudong New DistrictShanghai, Shanghai 201203), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/IB2025/058560) for "HOLLOW FILL ADDITIVE MANUFACTURING" on Aug 26, 2025. With publication no. WO/2026/058093, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KEEN, Martin (c/o IBM Corporation3039 E Cornwallis RdP....