GENEVA, Sept. 24 -- TEXAS INSTRUMENTS INCORPORATED filed a patent application (US2026/019351) for “INTEGRATED CIRCUIT WITH EMBEDDED SUBSTRATE AND MAGNETIC MOLD COMPOUND”. With publication no. WO/2026/198433, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01F 27/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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