INTERNATIONAL PATENT: INSTITUTE OF MICROELECTRONICS OF THE CHINESE ACADEMY OF SCIENCES, 中国科学院微电子研究所 FILES APPLICATION FOR "WAFER BONDING METHOD AND HETEROGENEOUS WAFER"

GENEVA, May 3 -- INSTITUTE OF MICROELECTRONICS OF THE CHINESE ACADEMY OF SCIENCES (#3 Beitucheng West RoadChaoyang District, Beijing 100029), 中国科学院微电子研究所 (中国北京市朝阳区北土城西路3号) filed a patent application (PCT/CN2025/072377) for "WAFER BONDING METHOD AND HETEROGENEOUS WAFER" on Jan 15, 2025. With publication no. WO/2026/086035, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...