GENEVA, March 10 -- INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS (55, Hanyang Daehak-ro Sangrok-guAnsan-siGyeonggi-do 15588), 한양대학교 에리카산학협력단 (경기도안산시상록구 한양대학로 55) filed a patent application (PCT/KR2025/012662) for "TGV SUBSTRATE FOR ALLEVIATING THERMAL STRESS AND MANUFACTURING METHOD THEREOF" on Aug 21, 2025. With publication no. WO/2026/049404, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...