International Patent: IMPROVING HIGH-ASPECT-RATIO DEVICES DIELECTRIC MATERIAL PATTERNING THROUGH SURFACE CHARGE RELAXATION

GENEVA, Sept. 18 -- APPLIED MATERIALS, INC. filed a patent application (US2026/015001) for “IMPROVING HIGH-ASPECT-RATIO DEVICES DIELECTRIC MATERIAL PATTERNING THROUGH SURFACE CHARGE RELAXATION”. With publication no. WO/2026/187492, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 20/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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