GENEVA, June 26 -- QUALCOMM INCORPORATED filed a patent application (US2025/055937) for “IMPROVING CURRENT STARVED DELAY LINE BANDWIDTH ACROSS PROCESS CORNERS”. With publication no. WO/2026/122296, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H03L 7/081
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....