GENEVA, June 26 -- QUALCOMM INCORPORATED filed a patent application (US2025/055937) for “IMPROVING CURRENT STARVED DELAY LINE BANDWIDTH ACROSS PROCESS CORNERS”. With publication no. WO/2026/122296, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H03L 7/081

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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