GENEVA, July 6 -- SMART PACKAGING SOLUTIONS filed a patent application (EP2025/084798) for “IMPROVED CHIP CARD WITH A FLIP-CHIP MODULE”. With publication no. WO/2026/139183, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06K 19/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....