GENEVA, Oct. 5 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/044770) for “IC SENSOR PROCESS UTILIZING GOLD WIRE-BONDING”. With publication no. WO/2026/206377, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01N 27/12
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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