GENEVA, Nov. 6 -- DIC CORPORATION filed a patent application (JP2026/014774) for “HYDROCARBON VINYL RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR ENCAPSULANT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING HYDROCARBON VINYL RESIN”. With publication no. WO/2026/230306, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08F 12/34
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....