GENEVA, May 9 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/119748) for "PROCESSING MODULE FOR DOPED OPTICAL FIBER AMPLIFIER AND RELATED DEVICE OF PROCESSING MODULE" on Sep 08, 2025. With publication no. WO/2026/091887, the details related to the patent application was published on May 07, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, whic...