GENEVA, April 17 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/126521) for "HEAT CONDUCTION STRUCTURE, PREPARATION METHOD THEREFOR, PACKAGING STRUCTURE, AND ELECTRONIC DEVICE" on Oct 09, 2025. With publication no. WO/2026/077392, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) sy...