GENEVA, May 10 -- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD. (Office 01, 39th Floor, Block A, Antuoshan Headquarters Towers33 Antuoshan 6th Road, Futian DistrictShenzhen, Guangdong 518043), ABEBE, Robert (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich) filed a patent application (PCT/EP2024/080683) for "JET IMPINGEMENT COOLING OF ELECTRONIC MODULE" on Oct 30, 2024. With publication no. WO/2026/092837, the details related to the patent application was published on May 07, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MAKSIMOV, Aleksei (Huawei Technologies Duesseldorf GmbHRiess...