GENEVA, June 19 -- HEFEI UNIVERSITY OF TECHNOLOGY filed a patent application (CN2025/108961) for “HOT STAMPING DIE AND APPARATUS WITH DIRECT COOLING STRUCTURE, AND HOT STAMPING METHOD”. With publication no. WO/2026/103203, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B21D 37/10
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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