GENEVA, July 1 -- KANEKA CORPORATION filed a patent application (JP2025/042068) for “HOT-MELT CURABLE COMPOSITION AND HOT-MELT ADHESIVE”. With publication no. WO/2026/126885, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 55/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....