GENEVA, Aug. 7 -- ZEON CORPORATION filed a patent application (JP2026/001173) for “HOLLOW PARTICLE, RESIN COMPOSITION, AND MOLDED BODY”. With publication no. WO/2026/163847, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08J 3/24
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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