INTERNATIONAL PATENT: HMD MOBILE (SHENZHEN) CO., LTD., HMD GLOBAL OY FILES APPLICATION FOR "SYSTEM FOR DISASSEMBLING COVER OF USER DEVICE, USER DEVICE, TOOL AND METHOD"

GENEVA, March 8 -- HMD MOBILE (SHENZHEN) CO., LTD. (Units 2201-2206, Tower B Raffles Office Building, No. 2163 Nanhai Road, Dengliang Community, Nanshan Residential District, Nanshan DistrictShenzhen, Guangdong 518054), HMD GLOBAL OY (Bertel Jungin Aukio 9, Espoo02600) filed a patent application (PCT/CN2024/116283) for "SYSTEM FOR DISASSEMBLING COVER OF USER DEVICE, USER DEVICE, TOOL, AND METHOD" on Sep 02, 2024. With publication no. WO/2026/044782, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JIANG, Tony (Units 2201-2...