GENEVA, April 7 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目１７番１号) filed a patent application (PCT/JP2025/033025) for "PLASMA PROCESSING APPARATUS, METHOD FOR DISASSEMBLING PLASMA PROCESSING APPARATUS, AND METHOD FOR ASSEMBLING PLASMA PROCESSING APPARATUS" on Sep 19, 2025. With publication no. WO/2026/070643, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is ...