INTERNATIONAL PATENT: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., 青岛海信宽带多媒体技术有限公司 FILES APPLICATION FOR "OPTICAL MODULE, LASER EPITAXIAL WAFER AND METHOD FOR PREPARING LASER EPITAXIAL WAFER"

GENEVA, April 4 -- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD. (No.218 Qianwangang Road, Economic and Technical Development ZoneQingdao, Shandong 266555), 青岛海信宽带多媒体技术有限公司 (中国山东省青岛市经济技术开发区前湾港路218号) filed a patent application (PCT/CN2024/140636) for "OPTICAL MODULE, LASER EPITAXIAL WAFER, AND METHOD FOR PREPARING LASER EPITAXIAL WAFER" on Dec 19, 2024. With publication no. WO/2026/065786, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent applicati...