GENEVA, July 9 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/128660) for “HIGH-THERMAL-CONDUCTIVITY MAGNESIUM-BASED COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR”. With publication no. WO/2026/144415, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C22C 23/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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