International Patent: HIGH-STRENGTH EPOXY MOLDING COMPOUND FOR ALUMINUM CAPACITOR AND PREPARATION METHOD THEREFOR

GENEVA, July 31 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. filed a patent application (CN2025/076502) for “HIGH-STRENGTH EPOXY MOLDING COMPOUND FOR ALUMINUM CAPACITOR AND PREPARATION METHOD THEREFOR”. With publication no. WO/2026/156940, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08L 63/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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