GENEVA, July 31 -- LEAR CORPORATION filed a patent application (US2026/012171) for “HIGH CURRENT RELAY MODULE AND ELECTRICAL SYSTEM”. With publication no. WO/2026/161577, here are the other details related to the patent application:
Kind: Initial Publication without ISR [A2]
IPC: H01H 50/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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