INTERNATIONAL PATENT: HEXION INC. FILES APPLICATION FOR "HARDENER COMPONENT FOR REACTIVE RESINS"

GENEVA, March 11 -- HEXION INC. (180 East Broad StreetColumbus, OH 43215) filed a patent application (PCT/US2025/043499) for "HARDENER COMPONENT FOR REACTIVE RESINS" on Aug 26, 2025. With publication no. WO/2026/050232, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PACHECO, Daniel (c/o Hexion Inc.610 South Second StreetSpringfield, OR 97477), SIMPSON, Kaelt Lian (c/o Hexion Inc.610 South Second StreetSpringfield, OR 97477), MANJI, Sean Elliott (c/o Hexion Inc.610 South Second StreetSpringfield, OR 97477), GOODRICH, J. T...