GENEVA, March 30 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/075996) for "DUAL CURING COMPOSITION" on Sep 12, 2025. With publication no. WO/2026/061888, the details related to the patent application was published on Mar 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): CHEN, Chunfu (Imaikami-cho 10-1-501, Nakahara-ku, Kawasaki-shiKanagawa Prefecture, 211-0067)
Abstract: A composition comprising: a) an ethylenically unsaturated monomer constituent comprising: a1) at least one epoxy (meth)acrylate monomer, said monomer having at least on...