INTERNATIONAL PATENT: HENKEL AG & CO. KGAA FILES APPLICATION FOR "BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE LAYER"

GENEVA, April 13 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/076022) for "BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE LAYER" on Sep 12, 2025. With publication no. WO/2026/073677, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FRANKEN, Uwe (HaselnuBweg 441542 Dormagen), SCHRIEFERS, Mathias (Am Schomm 5241199 Monchengladbach), FRIEDRICH, Norman (Mecumstrasse 1440225 Duesseldorf)

Abstract: A bonded structure comprising: a first substrate; a seco...