INTERNATIONAL PATENT: HENKEL AG & CO. KGAA, ABLESTIK (SHANGHAI) LTD. FILES APPLICATION FOR "SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME"

GENEVA, April 4 -- HENKEL AG & CO. KGAA (Henkelstrasse 67 Duesseldorf40589), ABLESTIK (SHANGHAI) LTD. (No. 332 MeiGui South Road, WaiGaoQiao Free Trade ZonePudong New Area, Shanghai 200131) filed a patent application (PCT/CN2024/121046) for "SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME" on Sep 25, 2024. With publication no. WO/2026/064977, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YAO, Wei (56-701, No. 433 Xinhang RoadPudong New Area, Shanghai 200129), WANG, Jingzhong (22-502, No. 709 Xinchuan...