INTERNATIONAL PATENT: HENKEL AG & CO. KGAA, ABLESTIK (SHANGHAI) LTD. FILES APPLICATION FOR "SILVER SINTERABLE BONDING MATERIAL FOR BENDED DISPENSING TOOL AND SEMICONDUCTOR DEVICE USING THE SAME"

GENEVA, May 9 -- HENKEL AG & CO. KGAA (Henkelstrasse 67, 40589 Duesseldorf), ABLESTIK (SHANGHAI) LTD. (No. 332 Meigui South Road, Waigaoqiao Free Trade ZonePudong New Area, Shanghai 200131) filed a patent application (PCT/CN2024/127645) for "SILVER SINTERABLE BONDING MATERIAL FOR BENDED DISPENSING TOOL AND SEMICONDUCTOR DEVICE USING THE SAME" on Oct 28, 2024. With publication no. WO/2026/090776, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YU, Yuanyuan (Room 1703, No. 12, Lane 1811, Zhangyang Rd.Pudong New Area, Shangh...