INTERNATIONAL PATENT: HENGDIAN GROUP DMEGC MAGNETICS CO., LTD., 横店集团东磁股份有限公司 FILES APPLICATION FOR "METHOD FOR USING LASER TO REMOVE WRAP-AROUND LAYER OF TBC SOLAR CELL SILICON WAFER"

GENEVA, April 4 -- HENGDIAN GROUP DMEGC MAGNETICS CO., LTD. (No. 233, Huaxia Avenue, Hengdian Town, DongyangJinhua, Zhejiang 322100), 横店集团东磁股份有限公司 (中国浙江省金华市东阳市横店镇华夏大道233号) filed a patent application (PCT/CN2025/114328) for "METHOD FOR USING LASER TO REMOVE WRAP-AROUND LAYER OF TBC SOLAR CELL SILICON WAFER" on Aug 13, 2025. With publication no. WO/2026/066764, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (...